Product Introduction
The Epoxy Filling Machine is a dedicated automated dispensing and potting device tailored for fluid pouring, quantitative filling and fixed-point glue dispensing of various liquid materials. It adopts precision flow control and stable delivery structure, realizing accurate glue output, uniform molding and no overflow or dripping. The equipment runs with steady rhythm and high repeat positioning accuracy, perfectly suited for quantitative glue filling and sealing processing of electronic modules, electrical components and insulation parts.
Key Benefits
▶Features fine flow rate regulation, enabling precise micro-volume filling without overflow or shortage
▶Adopts isolated material channel design to avoid glue cross-contamination and material deterioration
▶Low pulsation feeding mode ensures even glue layer and smooth surface forming

Technical Specifications
|
Machine Name |
Epoxy Filling Machine |
|
Applicable Material |
Epoxy resin, silica gel, insulating adhesive, liquid pouring material |
|
Control System |
PLC + Touch Screen Formula Control |
|
Working Voltage |
220V 50Hz |
|
Glue Mode |
Quantitative fixed-point automatic filling |
|
Machine Structure |
Bench type integrated frame |
Applications & Components
▶Electronic module encapsulation
▶Electrical component insulation pouring
▶Power adapter glue filling

Why Choose This Machine
This epoxy filling equipment adopts independent fluid calibration structure and anti-curing blocking design, maintaining stable glue output accuracy all year round, and it supports customized dispensing paths and formula setting to reduce material waste and boost finished product qualification rate.
Part of Your Smart Factory
The machine can work independently as a standalone unit or be embedded seamlessly into automated assembly lines, with built-in production record and working status feedback functions to meet digital workshop standardized production and traceability management.
FAQ(Frequently Asked Questions)
Q: Does it bubble easily during epoxy filling?
A: It adopts smooth material conveying and buffer discharging structure, which can effectively exhaust air and avoid bubble generation inside the glue layer.
Q: Can it adapt to indoor temperature and humidity changes?
A: It has stable constant-temperature feeding control, which can resist the influence of ambient temperature and humidity and keep filling effect consistent.
Q: Can production parameters be locked to avoid misadjustment?
A: It supports permission management and parameter locking function, preventing arbitrary modification and ensuring stable production standards.
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